AMD has announced an expansion of its Embedded Solutions offerings to include the new AMD Sempron Processor Model 2100+ and the AMD Geode LX 800 @ 0.9W Processor, which can now support designs to be deployed in harsh temperature environments.
The AMD Sempron Processor Model 2100+ offers fanless system design and incorporates AMD64 technology in a 9 W power envelope. This processor will provide particular advantages for designers focused on delivering high performance and functionality in single board computing and embedded client systems and is compatible with the recently announced AMD M690T chipset. It also features the high shock and vibration specification Socket S1, offering high reliability for ruggedised computing.
Extended temperature support can be particularly critical in extreme computing environments. Applications such as telecommunications infrastructure (including wired, wireless and MSB/MSC), single board computing, automotive and transportation systems, and industrial control and monitoring often require temperature support in the -40 to +85°C range, which can now be supported with the AMD Geode LX 800 @ 0.9W processor.
“By expanding our product portfolio with this new, very low power version of the highly successful AMD Sempron processor and extending the temperature support in our Geode line, AMD is delivering on our promise of customer-centric innovation for a range of embedded markets,” said Gautam Srivastava, vice president, sales and marketing and managing director, Middle East, Africa and Pakistan, AMD. “You will continue to see AMD offer our embedded customers the products and tools they need to get high performance, very low power products to market quickly.”